Current Sensor Simulation Tool

Design your current rail with confidence. Infineon's 3D simulation tool for XENSIV^TM current sensors predicts the magnetic field of your busbar or PCB layout and delivers the key figures that matter: field transferfactor, electrical resistance and power dissipation.
Explore how mounting tolerances (x, y, z displacement of the sensor) and crosstalk from neighboring phases in a three-phase system affect your results, before you build the first prototype.
Note: Results of this tool are Infineon intellectual property and may be used free of charge in combination with Infineon XENSIV^TM current sensors.

Solder Resist Top			Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 0µm
Core	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 215µm
Solder Resist Bottom

Solder Resist Top			Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 0µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 215µm
Core	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 430µm
Dielectric 2	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 645µm
Solder Resist Bottom

Solder Resist Top			Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 0µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 215µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 430µm
Core	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 645µm
Dielectric 3	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 860µm
Dielectric 4	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1075µm
Solder Resist Bottom

Solder Resist Top			Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 0µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 215µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 430µm
Dielectric 3	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 645µm
Core	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 860µm
Dielectric 4	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1075µm
Dielectric 5	µm
Layer 7	µm	Contains Current Rail	layer_7_position: 1290µm
Dielectric 6	µm
Layer 8	µm	Contains Current Rail	layer_8_position: 1505µm
Solder Resist Bottom

Solder Resist Top			Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 0µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 215µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 430µm
Dielectric 3	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 645µm
Dielectric 4	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 860µm
Core	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1075µm
Dielectric 5	µm
Layer 7	µm	Contains Current Rail	layer_7_position: 1290µm
Dielectric 6	µm
Layer 8	µm	Contains Current Rail	layer_8_position: 1505µm
Dielectric 7	µm
Layer 9	µm	Contains Current Rail	layer_9_position: 1720µm
Dielectric 8	µm
Layer 10	µm	Contains Current Rail	layer_10_position: 1935µm
Solder Resist Bottom