Current Sensor Simulation Tool

Infineon's innovative simulation tool for XENSIV^TM Current Sensors offers accurate 3D calculation of the magnetic field. For a user-defined busbar geometry or PCB structure the tool will calculate the key performance parameters like magnetic field transferfactor, electrical resistance and power dissipation. Additionally the tool allows to study the impact of mounting tolerance as the current sensor might be displaced (x,y,z translations) with respect to the sensing structure.
Note: Results of this simulation tool are Infineon intellectual property. They may be used free of charge in combination with the Infineon XENSIV^TM Current Sensors.

Design Selection

Geometry Parameters

Sensor Parameters

Advanced Settings

Results

Busbar Design

PCB Design

Solder Resist Top	µm		Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 20µm
Core	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 235µm
Solder Resist Bottom	µm

Solder Resist Top	µm		Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 20µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 235µm
Core	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 450µm
Dielectric 2	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 665µm
Solder Resist Bottom	µm

Solder Resist Top	µm		Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 20µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 235µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 450µm
Core	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 665µm
Dielectric 3	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 880µm
Dielectric 4	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1095µm
Solder Resist Bottom	µm

Solder Resist Top	µm		Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 20µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 235µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 450µm
Dielectric 3	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 665µm
Core	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 880µm
Dielectric 4	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1095µm
Dielectric 5	µm
Layer 7	µm	Contains Current Rail	layer_7_position: 1310µm
Dielectric 6	µm
Layer 8	µm	Contains Current Rail	layer_8_position: 1525µm
Solder Resist Bottom	µm

Solder Resist Top	µm		Layer Position w.r.t. top of PCB
Layer1	µm	Contains Current Rail	layer_1_position: 20µm
Dielectric 1	µm
Layer 2	µm	Contains Current Rail	layer_2_position: 235µm
Dielectric 2	µm
Layer 3	µm	Contains Current Rail	layer_3_position: 450µm
Dielectric 3	µm
Layer 4	µm	Contains Current Rail	layer_4_position: 665µm
Dielectric 4	µm
Layer 5	µm	Contains Current Rail	layer_5_position: 880µm
Core	µm
Layer 6	µm	Contains Current Rail	layer_6_position: 1095µm
Dielectric 5	µm
Layer 7	µm	Contains Current Rail	layer_7_position: 1310µm
Dielectric 6	µm
Layer 8	µm	Contains Current Rail	layer_8_position: 1525µm
Dielectric 7	µm
Layer 9	µm	Contains Current Rail	layer_9_position: 1740µm
Dielectric 8	µm
Layer 10	µm	Contains Current Rail	layer_10_position: 1955µm
Solder Resist Bottom	µm